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Amkor Technology, Inc.

Email address and contacts

Quick try with Jack Bruyn from amkor.com

Amkor Technology, Inc. company description

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Key Employees

  • Jack Bruyn
    Vice President Finance Systems
  • Karl Bernardo
    Recruitment Supervisor
  • Brandon Light
    Infosec intern

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New team members of Amkor Technology, Inc.

泰億 李
製程工程師
Ana Dile
HR Analyst (Recruitment)
Jinkon So
S. Director
Seng Tang
Senior Director
子慶 詹
工程師
Raj J
Director
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